siliconic carbide rings
Crafted with silicon carbide’s ultra-high hardness and thermal stability, our rings deliver superior sealing and wear resistance in extreme environments. Designed for high-temperature, high-corrosion scenarios, they maintain structural integrity under relentless industrial stress.
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What is a Silicon carbide ring?
Common Rings Hole Structures
The structural design of silicon carbide rings directly impacts performance in extreme conditions:
Straight - Wall Type
Tapered Type (Conical)
Grooved Type (Spiral/Annular)
What Products Are Commonly Used For?
The core value of tungsten carbide rings lies in delivering exceptional wear resistance and structural stability under harsh industrial conditions. By leveraging their high hardness and adjustable material formulations (e.g., cobalt/nickel binders), they replace vulnerable metals or ceramics in critical sealing, load – bearing, and wear – prone components. This reduces equipment downtime, cuts replacement costs, and maintains precise dimensional accuracy over long – term operation, outperforming conventional materials in extreme scenarios.
Pumps
Compressors
Agitators
Valves
Rotary Joints
Application Scenarios of Rings
With unparalleled hardness and corrosion resistance, silicon carbide rings excel in industrial realms demanding extreme performance. From aerospace engines to corrosive chemical systems, their applications redefine the boundaries of material reliability.
Mechanical Sealing Field
Chemical Equipment
Mechanical Engineering Field
Metal Rolling Scenarios
What You Need to Know About Common Ring Parameters
The common parameters of tungsten carbide rings mainly revolve around aspects like material composition, physical properties, and dimensional accuracy. Different application scenarios emphasize distinct parameters. Here’s a breakdown of the core parameters
Material-Related Parameters
| SiC Composition | Core Performance | Typical Scenarios |
|---|---|---|
| Pure SiC (≥99.5%) | High purity, low impurity for precision applications; excellent chemical resistance | Semiconductor fabrication (wafer carriers), medical devices (laser components), high-precision sealing systems |
| Composite SiC (5–10% additives: Al₂O₃, B₄C) | Enhanced thermal conductivity; improved thermal shock resistance | Heat-intensive systems (turbine seals, engine components), high-temperature heat exchangers |
- • ❗ Pure SiC ensures chemical stability; composite variants optimize thermal properties for extreme heat.
| Binder Type | Core Property | Applicable Scenarios |
|---|---|---|
| Reaction-bonded SiC | No binder; high purity retention; cost-effective manufacturing | Semiconductor etching tools (plasma chambers), chemical processing vessels |
| Sintered SiC (trace metal oxides) | Densified structure; high hardness and wear resistance | High-pressure mechanical seals (pumps, compressors), abrasive environments (slurry pumps, sand blasting) |
| Hot-pressed SiC (supplementary variant) | Ultra-high density; superior mechanical strength | Aerospace thermal components (rocket nozzles), nuclear industry (fuel cladding) |
- • ❗ Reaction-bonded suits cost-sensitive precision; sintered/hot-pressed target high-performance industrial uses.
Physical Property Parameters
| Parameter | Core Feature | Use Case |
|---|---|---|
| Thermal Conductivity | 120–200 W/m·K (pure SiC: ~170 W/m·K; composite: ~120 W/m·K) | High: Semiconductor wafer heating/cooling Low: Insulated thermal barriers |
| Hardness | Mohs ~9.2 (equivalent to 2500–2800 HV) | Abrasion-resistant components (pump sleeves, cutting tools) |
- • ❗ Thermal conductivity varies with composition; hardness remains consistently high across variants.
Dimensional and Precision Parameters
| Parameter | Core Feature | Use Case |
|---|---|---|
| Inner Diameter | 5–500 mm (5–50 mm: micro-precision; 50–500 mm: large-scale industrial) | Small: Semiconductor wafer carriers, micro-fluidic seals Large: Industrial pump seals, aerospace engine components |
| Wall Thickness | 1–20 mm (1–5 mm: lightweight; 5–20 mm: high rigidity) | Thin: High-speed rotating seals (turbine shafts) Thick: Pressure-bearing rings (chemical reactors, high-pressure valves) |
| Roundness Tolerance | ≤ 0.001 mm (sub-micron precision for leak-free sealing) | Ultra-precision seals (hydrogen fuel cells, cryogenic systems, semiconductor vacuum chambers) |
| Surface Roughness | Sealing face: Ra ≤ 0.1 μm (general precision) Ultra-high vacuum: Ra ≤ 0.02 μm (atomically smooth finish) | Ra ≤ 0.1 μm: Mechanical seals (pumps, compressors) Ra ≤ 0.02 μm: UHV systems (semiconductor etching, space simulation chambers) |
- • ❗ Dimensional range covers micro to macro scales; geometric tolerances directly correlate with sealing reliability and system efficiency.
- • ❗ Ultra-low roughness (Ra ≤ 0.02 μm) enables “hermetic sealing” in vacuum environments where molecular leakage must be eliminated.
